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Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

The purpose of this paper is to present a fully conservative numerical algorithm for solving the coupled shallow water hydro-sediment-morphodynamic equations governing fluvial processes, and also to clarify the performance of a conventional algorithm, which redistributes the variable water-sediment mixture density to the source terms of the governing equations and accordingly the hyperbolic operator is rendered similar to that of the conventional shallow water equations for clear water flows.

The coupled shallow water hydro-sediment-morphodynamic equations governing fluvial processes are arranged in full conservation form, and solved by a well-balanced weighted surface depth-gradient method along with a slope-limited centred scheme. The present algorithm is verified for a spectrum of test cases, which involve complex flows with shock waves and sediment transport processes with contact discontinuities over irregular topographies. The computational results of the conventional algorithm are compared with those of the present algorithm and evaluated by available referenced data.

The fully conservative numerical algorithm performs satisfactorily over the spectrum of test cases, and the conventional algorithm is confirmed to work similarly well.

A fully conservative numerical algorithm, without redistributing the water-sediment mixture density, is proposed for solving the coupled shallow water hydro-sediment-morphodynamic equations. It is clarified that the conventional algorithm, involving redistribution of the water-sediment mixture density, performs similarly well. Both algorithms are equally applicable to problems encountered in computational river modelling.